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Verlag: Springer International Publishing, 2023
ISBN 10: 3030982319ISBN 13: 9783030982317
Anbieter: Buchpark, Trebbin, Deutschland
Buch
Zustand: Wie neu. Zustand: Wie neu | Seiten: 424.
Verlag: Springer International Publishing 2022-06-28, Berlin, 2022
ISBN 10: 3030982289ISBN 13: 9783030982287
Anbieter: Blackwell's, London, Vereinigtes Königreich
Buch
hardback. Zustand: New. Language: ENG.
Verlag: Springer International Publishing, 2022
ISBN 10: 3030982289ISBN 13: 9783030982287
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Buch
Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture design. The book provides a deep theoretical background covering all abstraction-levels needed to research and architect tomorrow's 3D-integrated circuits, an extensive set of optimization methods (for power, performance, area, and yield), as well as an open-source optimization and simulation framework for fast exploration of novel designs.
Verlag: Springer International Publishing, 2023
ISBN 10: 3030982319ISBN 13: 9783030982317
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Buch
Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture design. The book provides a deep theoretical background covering all abstraction-levels needed to research and architect tomorrow's 3D-integrated circuits, an extensive set of optimization methods (for power, performance, area, and yield), as well as an open-source optimization and simulation framework for fast exploration of novel designs.